Packaging Engineer Salary in California, USA

About DexcomFounded in 1999, Dexcom, Inc. (NASDAQ: DXCM), develops and markets Continuous Glucose Monitoring (CGM) systems for ambulatory use by people with diabetes and by healthcare providers for the treatment of people with diabetes. The company is the leader in transforming diabetes care and management by providing CGM technology to help patients and healthcare professionals better manage diabetes. Since the company's inception, Dexcom has focused on better outcomes for patients, caregivers, and clinicians by delivering solutions that are best in class - while empowering the community to take control of diabetes. Dexcom reported full-year 2022 revenues of $2.9B, a growth of 18% over 2021. Headquartered in San Diego, California, with additional offices in the Americas, Europe, and Asia Pacific, the company employs over 8,000 people worldwide.Meet the team:You will be part of the Global Engineering team within Operations, tasked with end-to-end technical oversight of our suppliers, contract manufactures and automation houses. You will bring your expertise and passion for packaging, labeling, and adhesive design and manufacturing to ensure robust new product design instructions, capacity expansions, and on-market sustained performance. This crucial role supports Dexcom's thrilling growth trajectory in delivering essential, life-changing products to our valued customers. As part of this dynamic and highly effective team, you will collaborate closely across multiple functions, gaining broad exposure to our entire product life cycle.Where you come in: You will provide technical expertise in leading and advising programs covering a broad range of packaging and labeling designs, material selection, and process capability mapping and validation. With functional knowledge of adhesive systems, their design and qualification. Specializing in the integration with complex, sensitive products for global distribution.You will support a range of programs from new product introductions and launches to scale up, on-market, and end of life management. Leading collaborative efforts and directing package, label, and adhesive development activities, ensuring seamless progression, timely feedback, and optimization, while fostering teamwork and accountability.You will collaborate closely with the Purchasing and Quality organizations to establish a rigorous supplier selection process, ensuring timely launches and sustained performance at the optimal cost profile.You will ensure adherence to design, quality, and international standards. As well as support the planning and execution of robust new material validations and on-market change assessments. You will provide technical leadership to suppliers and internal teams, ensuring adherence to sound engineering practices throughout the supply chain, fostering strong partnerships and promoting a culture of excellence and continuous improvement.You will provide technical insight in the development and implementation of on-market support initiatives to maintain the yield, performance, and quality of products and subcomponents.What makes you successful: You are respected by your peers for your demonstrated strength in packaging, labeling, and adhesives and your ability to apply this knowledge within a dynamic, high-volume, and highly regulated industry.You leverage your demonstrated experience in collaborating with R&D on design for manufacturing considerations for new product development and foster productive partnerships for stable on-market performance while driving continuous improvement.You stay abreast of advancing technologies and processes, and the competitive landscape, proactively seeking out opportunities for implementation.You closely engage with cross-functional partners in manufacturing, R&D, supply chain, and quality assurance.You drive innovation in approach, processes, and methodologies while ensuring adherence to company, customer, and industry requirements and specifications. This includes offering recommendations for technology and process solutions to enhance performance and achieve both short-term and long-term objectives.You engage in an environment of personal and team accountability, that is conducive the development and growth of the team through mentoring and coaching.Travel Required: 15-25%Experience and Education Requirements:Typically requires a Bachelor's degree in a technical discipline, and a minimum of 13+ years related experience or a Master's degree and 8+ years equivalent industry experience of a PhD and 5+ years of experienceFlex Workplace: Your primary location will be a home office. You will not have an assigned workstation and will work with your manager to determine office visit needs. You must live within commuting distance of your assigned Dexcom site (typically 75 miles/120km).Please note: The information contained herein is not intended to be an all-inclusive list of the duties and responsibilities of the job, nor are they intended to be an all-inclusive list of the skills and abilities required to do the job. Management may, at its discretion, assign or reassign duties and responsibilities to this job at any time. The duties and responsibilities in this job description may be subject to change at any time due to reasonable accommodation or other reasons. Reasonable accommodations may be made to enable individuals with disabilities to perform essential functions. An Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, age, national origin, or protected veteran status and will not be discriminated against on the basis of disability. Dexcom's AAP may be viewed upon request by contacting Talent Acquisition at [email protected]. If you are an individual with a disability and would like to request a reasonable accommodation as part of the employment selection process, please contact Dexcom Talent Acquisition at [email protected]. View the OFCCP's Pay Transparency Non Discrimination Provision at this link. Meritain, an Aetna Company, creates and publishes the Machine-Readable Files on behalf of Dexcom. To link to the Machine-Readable Files, please click on the URL provided: https://health1.meritain.com/app/public/#/one/insurerCode=MERITAIN_I&brandCode=MERITAINOVER/machine-readable-transparency-in-coverage?reportingEntityType=TPA_19874&lock=trueTo all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Dexcom. Only authorized staffing and recruiting agencies may use this site or to submit profiles, applications or resumes on specific requisitions. Dexcom does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to the Talent Acquisition team, Dexcom employees or any other company location. Dexcom is not responsible for any fees related to unsolicited resumes/applications.Salary:$141,800.00 - $236,400.00

Location: REMOTESalary: $65.00 USD Hourly - $80.00 USD HourlyDescription: As a PWB Designer, you'll play a crucial role in creating cutting-edge printed wiring board layouts. Collaborating closely with schematic designers and other engineering team members, you'll contribute to the development of high-density PWB designs. Your work will involve implementing complex layouts and ensuring adherence to industry standards. This job will have the following responsibilities: Collaborate with electrical and packaging engineers to design and lay out PWBs.Create moderate to highly complex PWB designs.Assist in constraint editing and entry.Interpret and understand design requirements.Demonstrate proficiency with design tools.Work closely with PWB manufacturing engineers to define fabrication criteria.Implement advanced design techniques, including differential pairs, length matching, impedance control, blind and buried vias, and fine pitch component breakout.Follow established processes and work instructions.Provide inputs for associated documentation.Apply industry-standard practices for schematic and PWB designs (e.g., IPC-7351, JEDEC-JP95, MIL-STD-1835).Operate with minimal oversight from senior technical personnel.Identify and address design issues within the project team.Collaborate with multiple senior technical staff members on design projects.Adapt to inputs from various team members effectively.Communicate project status and issues to management and the project team.Efficiently execute tasks and drive PWB layout projects to completion. Qualifications & Requirements: Associates degree or certificate from a two-year technical school in an applicable discipline or demonstrated equivalent knowledge and skills.10+ years of experience in the field of PWB design or technical drafting with specific tools knowledge.Demonstrated ability to collect, organize, and capture design details in a fast-paced, dynamic environment.Excellent oral and written communication skills.Proven ability to work effectively in a hybrid work environment.Experience with bare die techniques such as wire bond, flip chip, and interposer design.Formal education in electronics or electrical circuit theory is a significant benefit.IPC Certification.Complementary domain knowledge or experience, such as PWB assembly, PWB fabrication, hardware assembly, or hardware test. Contact: [email protected] job and many more are available through The Judge Group. Find us on the web at www.judge.com

Meta is looking for an experienced Silicon Packaging design Engineer for its Ecosystem and Technical Operation team to support the development of custom Silicon for Infrastructure as well as to develop packaging solutions that are optimal for our ASIC roadmap. We are building a competency in Packaging technology to support the development of custom silicon and looking for expertise in hardware development and integration of machine learning clusters, both server and fabric with focus on the impact they can create as part of a world-class engineering team. Silicon Packaging Design Engineer Responsibilities: Perform package design for advanced custom silicon comprising single-chip/multi-chip and 3D or wafer packaging. This includes: design feasibility studies and analyses, package design/layouts based on silicon chip IO, electrical performance and system ID/form factor requirementsParticipate in silicon architecture/package/PCB/system co-design work collaborating with downstream system design teams and upstream silicon designers to develop holistically optimal solutionsCo-work with internal silicon, architecture and system teams and externally engaged partners, ASIC design partners, foundry and OSAT and substrate vendorsPerform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/3D and heterogeneous integration to improve bandwidth, power efficiency and package form factor for next generation versions of current productsLead package development to establish package manufacturability and reliabilityCollaborate with multi-functional teams with in Meta and define package requirements Minimum Qualifications:Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience.10+ years of experience in advanced silicon packaging designExperience in advanced package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.Basic understanding in one of the SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model.Hands of experience in interposer or fanout package design for both organic and inorganic interposer with or without bridgesBachelor's degree in Electrical engineering, Materials Engineering, Computer Engineering, relevant technical field, or equivalent practical experience.Proven fundamentals in the electrical/material/thermal or mechanical engineering field(s).Effective communication skills and experience working effectively with cross-functional teams Preferred Qualifications:Master's or PhD degree in Electrical/Materials engineeringExperience and prior experience of taking products from concept to prototyping and productionIn-depth knowledge of flip chip, 2.5D and 3D and wafer packaging technologies package designFamiliarity with CAM350/Valor or Calibre and CAD along with experience in package design reviews.Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).Solid understanding of Design Rules Check and Design for Manufacturing. About Meta: Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology. People who choose to build their careers by building with us at Meta help shape a future that will take us beyond what digital connection makes possible today-beyond the constraints of screens, the limits of distance, and even the rules of physics. Meta is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender, gender identity, gender expression, transgender status, sexual stereotypes, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics. We also consider qualified applicants with criminal histories, consistent with applicable federal, state and local law. Meta participates in the E-Verify program in certain locations, as required by law. Please note that Meta may leverage artificial intelligence and machine learning technologies in connection with applications for employment. Meta is committed to providing reasonable accommodations for candidates with disabilities in our recruiting process. If you need any assistance or accommodations due to a disability, please let us know at [email protected].$173,000/year to $249,000/year + bonus + equity + benefitsIndividual compensation is determined by skills, qualifications, experience, and location. Compensation details listed in this posting reflect the base hourly rate, monthly rate, or annual salary only, and do not include bonus, equity or sales incentives, if applicable. In addition to base compensation, Meta offers benefits. Learn more about benefits at Meta.

NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 fueled the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI - the next era of computing. NVIDIA is a "learning machine" that constantly evolves by adapting to new challenges that only we can pursue, and that matter to the world. This is our life's work, to amplify human creativity and intelligence. Make the choice to join us today!Chip Modeling and Packaging CAD team is responsible for development and support of infrastructure tools for build and verification of architectural, rtl, and gate level designs. Our tools enable our chip design teams to work on state-of-art design technologies such as CoWoS-L. As a software engineer, you will craft highly efficient software to automate and facilitate chip design and verification engineering workflows and processes, and look for ways to advance CAD tools using AI. What You'll be Doing:Work as a team to build reliable, scalable and high performance software that are easy to use by hundreds of engineers worldwide.Develop software tools in C++/Golang to analyze and construct chip designs described in C++, Verilog or domain-specific languages (DSLs).Research and develop software solutions to allow greater efficiency in architecture, hardware and software teams.Optimize the daily workflows of the world's top chip modelers and designers.What We Need to See:BS (or equivalent experience) and 10+ years of software development experience, MS (or PHD) preferred.Experienced with C++ or Golang, Unix/Linux.Solid understanding of algorithms, computer architecture and computer science theoryExperienced with VLSI physical design and packagingPassionate about SW development processesFlexibility/adaptability for working in a dynamic environment with different frameworks and requirementsExcellent communication, interpersonal and customer collaboration skillsWays to stand out from the crowd:Expertise in architecture, RTL design, netlist, placement and routing, power and thermal analysisStrong expertise in modern C++, compiler, build systems, and database.Experienced with static and dynamic code analysis toolsThe base salary range is 220,000 USD - 419,750 USD. Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.You will also be eligible for equity and benefits. NVIDIA accepts applications on an ongoing basis. NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

Join NVIDIA, a trailblazer at the forefront of graphics and artificial intelligence performance, efficiency, and innovation. From our roots as a groundbreaking graphics company, we have evolved into a global leader in artificial intelligence, continuously pushing the boundaries to tackle sophisticated challenges across diverse industries.NVIDIA's Silicon Solutions Group (SSG) seeks a Manufacturing Quality Engineer to join our Hardware Architecture Development (HW ArchDev) team. The SSG team provides a unique opportunity to engage with the entire product development cycle-from early architecture definition through bringup to product release. The HW ArchDev team is at the center of all silicon and system-level feature development, tradeoff analysis, system integration solutions, and system Product of Record (POR) alignment. As a Manufacturing Quality Engineer, you will be instrumental in ensuring that our manufacturing quality aligns with product needs. You will tackle sophisticated challenges related to power, thermal, and electrical energy at the system level and their impact on product quality and reliability.What you will be doing:Align manufacturing quality with product requirements and targets.Design and prototype new features to bridge gaps between product design targets and manufacturing testability.Develop systems to monitor Automated Test Equipment (ATE), System Level Test (SLT), and Board Level Test (BLT) programs to ensure alignment to specifications that affect bin split, yield, and power.Perform both WhiteBox and Blackbox testing as needed to validate manufacturing processes.Collaborate with ATE, SLT, and board-level teams to enhance existing testing flows, design new testing methodologies, and eliminate inefficiencies.What we need to see:Bachelor's degree (BS) or equivalent experience in Electrical Engineering (EE), Computer Engineering (CE), Computer Science (CS), Systems Engineering, or a related field with 8+ years of experience, or a Master's degree (MS) with 6+ years of experience in a related hardware engineering role.Proven experience improving testability limits and aligning product needs with ATE power, thermal, and packaging plans.Strong programming skills in Python and/or Perl to validate manufacturing test programs and analyze data to ensure the quality of pre-production or production silicon.In-depth knowledge of hardware engineering principles, especially in the context of manufacturing and quality assurance.Ways to stand out from the crowd:Experience with system-level feature development and integration in a hardware engineering context.Familiarity with system-level trends in power, thermal management, and their impact on quality and reliability.It's not just technology, though! It is our people, some of the brightest in the world. At the center of NVIDIA's culture are our core values, like innovation, perfection, determination, and teamwork, that guide us to be the best we can be. This makes NVIDIA one of the most innovative and multifaceted places to work. We do our life's work here, and if you are creative and driven, then we want to hear from you.#LI-HybridThe base salary range is 164,000 USD - 304,750 USD. Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.You will also be eligible for equity and benefits. NVIDIA accepts applications on an ongoing basis. NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

PsiQuantum is on a mission to build the world's first fault tolerant quantum computer capable of tackling today's most intractable computational challenges to deliver transformative results. We know that means it will need roughly 1 million qubits and will be building scale in size.Quantum computing is expected to deliver breakthroughs for today's still impossible computational tasks. By harnessing the laws of quantum physics, quantum computers can provide exponential performance increases over even the most powerful of today's conventional supercomputers offering the potential for extraordinary advances across a broad range of applications including climate, energy, healthcare, pharmaceuticals, finance, agriculture, transportation, materials design, and many more.PsiQuantum is uniquely positioned to deliver on the promise of quantum computing. Our architecture is based on photonics which gives us the ability to produce our components using high-volume semiconductor manufacturing processes, the same processes that have been applied in telecommunications and data center applications for decades. Since photons don't feel heat, we can take advantage of existing cryogenic cooling systems, the kind that have been operating at facilities like Stanford Linear Accelerator (SLAC) since 2018. And because photons are basically light, they can move between subsystems using standard fiber connectivity, without the need for transduction in and out.Our team is working across the full stack of quantum computing, from quantum architecture to photonic chip manufacturing, advanced opto-electronic packaging, hardware systems design, quantum algorithms and software tools, and cryogenic cooling. We're a highly motivated and collaborative group focused on a singular goal - building the world's first Fault Tolerant Quantum Computer on the fastest path possible.There's more work to be done and we are looking for exceptional talent to join us on this extraordinary journey!Job Summary:As part of the System Build and Validation Team the Optical Systems Manufacturing Development Engineer is responsible for the construction of high performance fiber optic subsystem components including EDFA's, high speed optical timing, and polarization control modules.Responsibilities:Ownership of the construction of optical fiber subsystems and modules, including electrical/electronic control and mechanical assemblies.Drive assembly protocol and version controlled documentation including the composition and authoring of clear, detailed methodologies for both assembly and test.Management of bill of materials (BOM), documentation and continuous product improvement (CPI).Collection, tracing and analysis of build data including design and component troubleshooting.Work closely with supply chain and vendors, design engineering, and technicians to improve current and future generations of product.Work with cross-functional teams to execute debug tests for software and hardware control systems.Required Experience: B.S. in Physics, Optical or Electrical Engineering preferred, with 4+ years industry experience.Experience working with fiber lasers and amplifiers, fiber optic components, splice equipment and optimization, fiber routing and equipment maintenance.Experience validating and testing fiber optic components and systems transferring design and development into robust and scalable products.Experience working with optical test equipment including polarization analysis, insertion/return loss, optical backscatter reflectometers (OBR), optical spectrum analyzer (OSA).Python scripting, calling Controls SW APIs / drivers to control lab equipment and proprietary systems.Preferred Skills & Experience:Expertise with advanced fiber optic technologies such as sensing, timing distribution, clock distribution, optical transmission systems.Knowledge of Si Photonics and fiber to chip optical coupling.PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.We are not accepting unsolicited resumes from employment agencies.Pay Range:$172,000 - $205,500

Date Posted:2024-09-09Country:United States of AmericaLocation:AZ862: 3360 Hemisphere Loop Bldg M10 3360 East Hemisphere Loop Building M10, Tucson, AZ, 85706 USAPosition Role Type:OnsiteAt Raytheon, the foundation of everything we do is rooted in our values and a higher calling - to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today's mission and stay ahead of tomorrow's threat. Our team solves tough, meaningful problems that create a safer, more secure world.The Product Design and Packaging (PDP) Team at Raytheon is seeking a Senior Electrical Engineer to join our team as an Electrical Computer Aided Designer Engineer (ECAD).Our Mission is to develop best in industry technologies that align product capabilities to the needs of our customer. We will empower our people to leverage design commonality and innovation, balancing risk and rigor, to achieve predictable and affordable solutions. We are looking for candidates willing to collaborate, innovate, and team with our engineers to generate and utilize today's cutting-edge technology.This position is an onsite role, located in Tucson, AZ.What You Will Do:Responsible for Printed Circuit Board (PCB) designs from conception to manufacturingCreation of the PCB, Circuit Card Assembly (CCA), and Schematic drawings for suppliersSchematic Capture, Component Placement, Routing of Traces, Gerber/ODB++ file creationUtilizing software such as Siemens: Xpedition Enterprise and DownStream Technologies: BluePrint-PCBDesign layouts include Rigid, Flex, and Rigid-Flex assembliesWork designs include full designs, re-spins, drawing updates, change notices, copper changes, and process improvement projects within and outside own disciplineDaily interface with various engineering levels along with different engineering disciplines including, but not limited to Electrical, Mechanical, Components, Test, and Producibility Engineering disciplines to ensure that the overall design requirements are captured, keeping cost, cycle time, and producibility in mindQualifications You Must Have:Typically requires a Bachelor's in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 5 years of prior relevant experience, or an Advanced Degree in a related field and minimum 3 years of experience to include at least two (2) of the following:Previous work history with PCB manufacturing or CCA manufacturing principles that affect circuitry and component layout along with RF specific layout techniquesExperience with the electrical design process including RF layoutHistory with laying out Rigid, Flex, or Rigid-Flex boardsThe ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.Qualifications We Prefer:Working knowledge of Analog, Digital including DDR, specific experience with RF, Power, and mixed technology, including multi-layer designs with High Density Interconnect (HDI) technologyTechnical PCB design skills using the Siemens design toolset including, but not limited to the Xpedition Layout tool suite with working knowledge of schematic capture, placement, routing, use of the auto-router, constraint manager, and library tools, and use of BluePrint to create complex PCB and CCA drawings, Altium is not used, but transfers over well to the Siemens toolsetExport manufacturing data in both Gerber and ODB++ formatsUse of Valor NPI, Design for Manufacturing rule sets, other Design Rule Checking softwareAble to understand and interpret drawings as they relate to PCB's and CCA'sFamiliarity with IPC 6012 & IPC 6013Working knowledge of military and commercial design standards, GD&T techniques, and overall producibility considerations related to electronic packagingKnowledge of RF circuitry and key care abouts when it come to laying out the board along with filter knowledgeWorking knowledge of operating system concepts and implementations, network services as related to Microsoft Windows suitesWillingness to work extended hours (nights and/or weekends) as required to complete assigned taskingActive Secret DoD security clearanceWhat We OfferOur values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value: Trust, Respect, Accountability, Collaboration, and Innovation.This position offers relocation based on candidate eligibility. Learn More & Apply Now!RTX solves some of the toughest challenges in aerospace and defense. That requires expansive thinking and bold innovation - and that, in turn, requires a culture that is diverse, equitable and inclusive.We embrace individuality and diversity of thought to fuel opportunity for our employees, our customers, and our communities. We work toward progress, knowing that a more inclusive world is critical to our mission. Not just in this moment, but always.This position requires a security clearance. DCSA Consolidated Adjudication Services (DCSA CAS), an agency of the Department of Defense, handles and adjudicates the security clearance process. More information about Security Clearances can be found on the US Department of State government website here: https://www.state.gov/m/ds/clearances/c10978.htmThe salary range for this role is 77,000 USD - 163,000 USD. The salary range provided is a good faith estimate representative of all experience levels. RTX considers several factors when extending an offer, including but not limited to, the role, function and associated responsibilities, a candidate's work experience, location, education/training, and key skills.Hired applicants may be eligible for benefits, including but not limited to, medical, dental, vision, life insurance, short-term disability, long-term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays. Specific benefits are dependent upon the specific business unit as well as whether or not the position is covered by a collective-bargaining agreement.Hired applicants may be eligible for annual short-term and/or long-term incentive compensation programs depending on the level of the position and whether or not it is covered by a collective-bargaining agreement. Payments under these annual programs are not guaranteed and are dependent upon a variety of factors including, but not limited to, individual performance, business unit performance, and/or the company's performance.This role is a U.S.-based role. If the successful candidate resides in a U.S. territory, the appropriate pay structure and benefits will apply.RTX anticipates the application window closing approximately 40 days from the date the notice was posted. However, factors such as candidate flow and business necessity may require RTX to shorten or extend the application window.RTX is An Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class.Privacy Policy and Terms:Click on this link to read the Policy and Terms

Date Posted:2024-09-09Country:United States of AmericaLocation:AZ852: RMS AP Bldg M02 1151 East Hermans Road Building M02, Tucson, AZ, 85756 USAPosition Role Type:OnsiteAt Raytheon, the foundation of everything we do is rooted in our values and a higher calling - to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today's mission and stay ahead of tomorrow's threat. Our team solves tough, meaningful problems that create a safer, more secure world. The RF Mechanical Team at Raytheon is seeking a talented Engineer to join our team in Tucson, AZ.The candidate will be responsible for providing innovative design solutions for the packaging of antennas, RF Circuit Card Assemblies, radomes, and RF test equipment. The selected candidate will be expected to lead diverse multidiscipline teams, provide technical oversight, delegate tasks, and work with the Engineering organization to establish technology roadmaps, enable modernization, and contribute to general innovation. In addition, the candidate will work with customer personnel and program leadership to define and refine requirements to validate hardware compliance. The candidate will be responsible for providing guidance, coaching, mentoring, and training to other employees across the business within the candidate's areas of expertise.This position is an onsite role, located in Tucson, AZ.What You Will DoSmall team technical developmentCommon and mature RF product developmentServe as a technical resource to the organization Qualifications You Must HaveTypically requires a Bachelor's in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 2 years of prior relevant experience to include any combination of the following:Performing design and analysis for the packaging of RF products (e.g. Circuit Card Assemblies, antennas, radomes, RF test equipment, harnesses and interconnects) throughout the product life cycle to include three dimensional (3D) Computer Aided Design (CAD) softwareCreation of Technical Data Packages (TDPs) using Geometric Dimensioning and Tolerancing (GD&T) for RF productsThe ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.Qualifications We PreferMaster of Science (MS) in mechanical engineering or electrical engineeringExperience serving as a Responsible Engineering Authority (REA), Control Account Manager (CAM), and/or Integrated Product Team Lead (IPTL)Supplier management for built to print or build to specification RF productsExperience creating and presenting professional level design documentation to company leadership and program customersCreo Simulate or ANSYS Workbench for preliminary structural and thermal analysis of design conceptsExcellent written and verbal communication skillsFailure investigation, root cause identification, and corrective action implementationFamiliarity or direct experience with RF Printed Circuit Board (PCB) material stack ups and Circuit Card Assembly (CCA) layoutOne dimensional tolerance analysis for complex mechanical assembliesDevelopment of technical proposals, engineering project estimates, and/or white papersRequirements verification test planning and executionWhat We OfferOur values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value: Trust, Respect, Accountability, Collaboration, and Innovation.This position offers relocation based on candidate eligibility. Learn More & Apply Now!RTX solves some of the toughest challenges in aerospace and defense. That requires expansive thinking and bold innovation - and that, in turn, requires a culture that is diverse, equitable and inclusive.We embrace individuality and diversity of thought to fuel opportunity for our employees, our customers, and our communities. We work toward progress, knowing that a more inclusive world is critical to our mission. Not just in this moment, but always.This position requires a security clearance. DCSA Consolidated Adjudication Services (DCSA CAS), an agency of the Department of Defense, handles and adjudicates the security clearance process. More information about Security Clearances can be found on the US Department of State government website here: https://www.state.gov/m/ds/clearances/c10978.htmThe salary range for this role is 64,000 USD - 128,000 USD. The salary range provided is a good faith estimate representative of all experience levels. RTX considers several factors when extending an offer, including but not limited to, the role, function and associated responsibilities, a candidate's work experience, location, education/training, and key skills.Hired applicants may be eligible for benefits, including but not limited to, medical, dental, vision, life insurance, short-term disability, long-term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays. Specific benefits are dependent upon the specific business unit as well as whether or not the position is covered by a collective-bargaining agreement.Hired applicants may be eligible for annual short-term and/or long-term incentive compensation programs depending on the level of the position and whether or not it is covered by a collective-bargaining agreement. Payments under these annual programs are not guaranteed and are dependent upon a variety of factors including, but not limited to, individual performance, business unit performance, and/or the company's performance.This role is a U.S.-based role. If the successful candidate resides in a U.S. territory, the appropriate pay structure and benefits will apply.RTX anticipates the application window closing approximately 40 days from the date the notice was posted. However, factors such as candidate flow and business necessity may require RTX to shorten or extend the application window.RTX is An Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class.Privacy Policy and Terms:Click on this link to read the Policy and Terms

The Company Dexcom Corporation (NASDAQ DXCM) is a pioneer and global leader in continuous glucose monitoring (CGM). Dexcom began as a small company with a big dream: To forever change how diabetes is managed. To unlock information and insights that drive better health outcomes. Here we are 25 years later, having pioneered an industry. And we're just getting started. We are broadening our vision beyond diabetes to empower people to take control of health. That means personalized, actionable insights aimed at solving important health challenges. To continue what we've started: Improving human health. We are driven by thousands of ambitious, passionate people worldwide who are willing to fight like warriors to earn the trust of our customers by listening, serving with integrity, thinking big, and being dependable. We've already changed millions of lives and we're ready to change millions more. Our future ambition is to become a leading consumer health technology company while continuing to develop solutions for serious health conditions. We'll get there by constantly reinventing unique biosensing-technology experiences. Though we've come a long way from our small company days, our dreams are bigger than ever. The opportunity to improve health on a global scale stands before us.Meet the team: We are seeking a highly skilled Staff Process Development Engineer with exceptional project leadership capabilities and technical expertise in equipment, test design, statistics, and process development. As a key member of our Engineering team, you will play a pivotal role in leading, developing, and optimizing manufacturing processes for medical devices, ensuring robustness, efficiency, and compliance with regulatory standards.Where you come in:Lead and manage process development projects from concept through commercialization, adhering to timelines and regulatory constraints.Design and optimize manufacturing processes for new and existing medical devices, focusing on scalability, efficiency, and quality improvement.Gather and analyze data using statistics, Measurement Systems Analysis, and Design Of Experiments efforts and their associated analysis toolsUtilize statistical tools and methods to analyze process data, conduct capability studies, and implement process controls.Collaborate cross-functionally with R&D, Quality Assurance, Regulatory Affairs, and Manufacturing teams to ensure seamless roll out of processes into production.Provide technical expertise in equipment selection, qualification, and validation, ensuring equipment meets performance and regulatory requirements.Develop and execute test methods and protocols to validate process performance and product quality.Plan, design, develop, and execute production cost and/or quality improvement projects including all necessary documentation.Develop and provide status presentations from the technical team up through executive leadershipMentor and guide junior engineers, fostering a culture of continuous learning and development within the team.Develop and execute testing and verification, and documentation activities.Follow design, quality, and safety guidelines based on GMP, FDA, and ISO guidelines and related Quality and Safety Standards and Practices.Other duties as assignedWhat makes you successful:Bachelor's degree in Mechanical Engineering, Biomedical Engineering, Chemical Engineering, or related field; Master's degree preferred.Relevant experience within the medical device industry, with demonstrated proficiency in project leadership.Proven expertise in equipment design, test method development, statistical analysis, and process development.Experience in at least 1 of the following areas; plastic component assembly, needles, adhesives, epoxies and packaging (sterile barrier, secondary, tertiary).Experience with statistics, Measurement Systems Analysis, and Design Of Experiments efforts and their associated analysis toolsStrong understanding of regulatory requirements (FDA, ISO, etc.) and experience in developing processes compliant with these standards.Excellent problem-solving skills and the ability to apply engineering principles to resolve complex technical challenges.Effective communicator with the ability to present technical information to diverse audiences and stakeholders.Experience with CAD software (e.g., SolidWorks) and statistical analysis software (e.g., JMP, Minitab) is highly desirable.Project management certification (PMP) or Six Sigma certification (e.g., Black Belt) is a plus.Experience with Databases and queries for data collection, aggregation, and analysisWhat you'll get: A front row seat to life changing CGM technology. Learn about our brave #dexcomwarriors community.A full and comprehensive benefits program.Growth opportunities on a global scale.Access to career development through in-house learning programs and/or qualified tuition reimbursement.An exciting and innovative, industry-leading organization committed to our employees, customers, and the communities we serve.Experience and Education:Typically requires a Bachelor's degree in a technical discipline, and a minimum of 8-12 years related experience or Master's degree and 5-7 years equivalent industry experience or a PhD and 2-4 years of experience.Travel Required: 25-50%Flex Workplace: Your primary location will be a home office. You will not have an assigned workstation and will work with your manager to determine office visit needs. You must live within commuting distance of your assigned Dexcom site (typically 75 miles/120km).Please note: The information contained herein is not intended to be an all-inclusive list of the duties and responsibilities of the job, nor are they intended to be an all-inclusive list of the skills and abilities required to do the job. Management may, at its discretion, assign or reassign duties and responsibilities to this job at any time. The duties and responsibilities in this job description may be subject to change at any time due to reasonable accommodation or other reasons. Reasonable accommodations may be made to enable individuals with disabilities to perform essential functions. An Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, age, national origin, or protected veteran status and will not be discriminated against on the basis of disability. Dexcom's AAP may be viewed upon request by contacting Talent Acquisition at [email protected]. If you are an individual with a disability and would like to request a reasonable accommodation as part of the employment selection process, please contact Dexcom Talent Acquisition at [email protected]. View the OFCCP's Pay Transparency Non Discrimination Provision at this link. Meritain, an Aetna Company, creates and publishes the Machine-Readable Files on behalf of Dexcom. To link to the Machine-Readable Files, please click on the URL provided: https://health1.meritain.com/app/public/#/one/insurerCode=MERITAIN_I&brandCode=MERITAINOVER/machine-readable-transparency-in-coverage?reportingEntityType=TPA_19874&lock=trueTo all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Dexcom. Only authorized staffing and recruiting agencies may use this site or to submit profiles, applications or resumes on specific requisitions. Dexcom does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to the Talent Acquisition team, Dexcom employees or any other company location. Dexcom is not responsible for any fees related to unsolicited resumes/applications.Salary:$111,100.00 - $185,100.00

ENGINEERS Atraverse Medical, Inc. seeks Senior R&D Engineers in Cardiff, CA. Candidates must have Master's degree in Biomedical Engineering or related; 3 years of industry medical device design/engineering experience, including specific experience with: (1) full life-cycle engineering of catheters, guidewires, RF energy delivery and sterile packaging from prototyping to product transfer, (2) clinical or animal lab experience, and (3) experience administrating SolidWorks and PDM; Knowledge of left heart (trans-septal) access technologies; and SolidWorks Mechanical Design Certification. Salary: $138,216. Submit resume and cover letter to dnafstad@ atraversemedical. com.recblid o0ozdzje84tgofhlcc8qrd89bqugj1