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Assembly Technician Salary in New Jersey, USA

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Principal R&D Scientist
Kelly Science, Engineering, Technology & Telecom, Piscataway
Kelly Science is seeking a Principal R&D Scientist for growing company located in Piscataway, NJ.Salary: $116,000-145,000/year based upon experience Shift: Monday - Friday 8:00am-5:00pmEmployment Type: Full Time; Direct HireSummary:As the Principal R&D Scientist, you will be responsible for developing new products, material testing strategies/protocols, formulations and modifying/optimizing existing products. During the process of new product development and creating technology roadmaps and strategies, you will be working closely with other scientists, product managers, application and marketing managers. Job duties include: Driving innovation through the development of new adhesive technologies, processes, and products.Serving as the technical lead for adhesive development projects, guiding the team through the research, development, and testing phases.Developing an in-depth understanding of the patent and literature for new resin systems, chemistry, and polymers across related technology areas.Monitoring the patent and technical documentsDelivering presentations/reports that contain complex ideas into precise results and proposals in a way for audiences of all levels to fully comprehend.Staying up-to-date with industry trends, emerging technologies and best practices in adhesive development and semiconductor packaging.Mentoring and providing technical guidance to junior level scientists and technicians.Qualifications: Master's degree of PhD in Material Science, Chemistry, Chemical Engineering or a scientific related field.5+ years of relevant industrial experience in adhesive research and development with a proven track record of providing innovative solutions for consumer electronics or semiconductor assembly applications or similar experience.Strong synthesis background of monomers and polymers especially with thermoset materials such as acrylics, epoxies, and polyurethanes.Strong knowledge of semiconductor packaging processes and materials is a plus.Hands-on experience with thermal, physical, and mechanical properties characterization including DMA, TMA, Rheology, GPC, etc.Strong problem-solving, organization and action-oriented skills are requireInterested? Please apply today for immediate consideration!